The new AXi 940 module will perform wafer frontside inspection as part of the all-surface Explorer(tm) Inspection Cluster—a multi-surface inspection ... ... The new AXi 940 module will perform wafer frontside inspection as part of the all-surface Explorer(tm) Inspection Cluster—a multi-surface inspection system designed to deliver fast, accurate and reliable macro inspection at a low cost-of-ownership. The new module is featured ...

SIDSA Intoduced Enter e1 Demodulator plus Application Processor Chipset. This new chipset complements the current offering of Intellectual Property for ... ... counts as IP customers to three of the top semiconductor vendors. The Enter e1 demodulator chipset provides best-in-class performance, specially in high speed conditions or high spectrum operation. The chipset targets easy integration into any device thanks to the internal ...

SIDSA Bring Live DVB-H Mobile TV Signals Coverage of CSTB Show in Moscow. SIDSA will use transmitters from its partner ... ... Moscow, 4th to 7th February. SIDSA will use transmitters from its partner MIER Communications and will showcase the services in Samsung mobile TV phones. SIDSA has a strong presence in Russia, with a commercial office in Moscow, and providing ...

MMCA And JEDEC Announced v4.3 Embedded MMC and Card Product Standard.The new features build on the eMMC standard, which is ... ... important step in the evolution of eMMC as an industry-leading memory technology, providing a standardized protocol for embedding mass storage flash memory on host systems. The new features build on the eMMC standard, which is currently supported by all ...

Digi Introduced the Digi Connect WAN 3G. The Digi Connect WAN 3G provides primary Wireless WAN connections to remote sites ... ... HSDPA and EVDO 3G standards and adds a cost optimized, high-speed solution to Digi's industry leading line of cellular routers. "The Digi Connect WAN 3G is great for customers needing high-speed connectivity without all the extras," said Larry Kraft, senior ...