NXP’s FM-RDS chip sets a new standard in radio performance, with better channel separation, best-in-class sensitivity, very high selectivity and clear sound. the TEA5990 FM radio IC allows OEMs to implement a complete radio solution without external components requiring less than 15mm2 of board space…
Building on its leadership position in FM Radio ICs, NXP Semiconductors, the independent semiconductor company founded by Philips, launched the world’s smallest highly-integrated FM stereo radio IC with R(B)DS functionality, the TEA5990. NXP’s FM-RDS chip sets a new standard in radio performance, with better channel separation, best-in-class sensitivity, very high selectivity and clear sound. The TEA5990 inches ahead of competitive offerings by using a command-based interface to simplify software development, making system integration easy and quick to enable OEMs to drive higher attach rates for FM radio in portable devices.
The new 150 Gb/s core delivers the performance and bandwidth that new designs require, now with higher data transfer rates. The higher performance Interlaken Core is fully scalable, ideally suited for multiple generations of future network switches, routers and storage equipment…
Silicon Logic Engineering Inc. (SLE), a high-end semiconductor design services division of Tundra Semiconductor Corporation, announced the availability of a new 150Gb/s high speed Interlaken protocol IP core for use in ASIC designs. SLE’s new Interlaken IP Core is now available with more than twice the performance of the standard 60Gb/s version. This new high-speed core delivers the performance and bandwidth that new designs require, now with higher data transfer rates. The higher performance Interlaken Core is fully scalable, ideally suited for multiple generations of future network switches, routers and storage equipment. The scalability is achieved through the combination of the SERDES speed (3.125Gbps to 6.375Gbps) and a variable number of SERDES lanes (1 to 24).
The DevKit OMAP35x and DevKit OMAP2530 each include a production-ready Windows® Embedded CE 6.0 board support package (BSP). New OMAP35x-based DevKit, OEMs and ODMs will be able to get their high-performance devices to market not only in significantly less time than before, but also with extremely low development risk…
At the 2008 Texas Instruments Developer Conference (TIDC), BSQUARE Corp. (Nasdaq: BSQR) announced that it is launching two new OMAP(tm) DevKit hardware development platforms to support TI’s OMAP35x(TM) and OMAP25x(TM) platform. The DevKit OMAP35x and DevKit OMAP2530 each include a production-ready Windows® Embedded CE 6.0 board support package (BSP), and is the only development platform available supporting OMAP(TM) processors running Windows CE. The development platform and BSP will help original equipment manufacturers (OEMs) build Windows Embedded CE-powered connected, multimedia, and embedded devices to reduce development costs and get their products to market faster.