Archive: March 2008 page# 3

Entries summary:

Elma Bustronic Announces MicroTCA Backplanes in The Pico Style Format

By pur, at Tuesday, March 4th, 2008, in Industrial, Manufacturing
elma-microTCA

  The first Pico backplane has been designed for sister-company Elma Electronic's 1U MicroTCA enclosure solution. The Pico format for MicroTCA is typically in a horizontally mounted chassis. The compact size saves vertical rack space. The backplane features a 20-layer controlled impedance stripline design..

 

Power Integrations Announces TOPSwitch-HX Series AC-DC ICs into eSIP-7C Power Package

By pur, at Tuesday, March 4th, 2008, in Development Tool, IC, Chip, SoC, Power

  The new eSIP package reduces power supply manufacturing costs. An easy-to-use, low-cost clip reduces heatsink assembly time and improves package to heatsink contact repeatability, ensuring consistently good thermal performance in contrast to the asymmetrically-mounted screw tab on the older TO-220 package design..

 

  IGBT devices have excessive switching losses at the frequencies used in UPS and solar inverters. The new family of IGBTs has lower collector-to-emitter saturation voltage (VCE(on)) and total switching energy (ETS) than punch-through (PT) and non-punch-through (NPT) type IGBTs..

 

Texas Instruments Introduces TPS780xx Low Dropout Linear Regulators with Dual-Level Voltage Output

By pur, at Tuesday, March 4th, 2008, in Microcontroller, Microprocessor, Power
ti-low drpout linear tps780xx

  TI's TPS780xx LDOs with selectable dual-level output voltages allow designers to dynamically shift to a lower voltage level in a battery-powered design when the microprocessor is in sleep mode. The TPS780xx is stable with any output capacitor greater than 0.1uF. The devices come in a 6-pin, 2 mm x 2 mm, SON package, which is targeted at portable applications..

 

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