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Embedded Systems and Microcontroller Electronics Daily News for Developers and Decision Makers

The first Pico backplane has been designed for sister-company Elma Electronic's 1U MicroTCA enclosure solution. The Pico format for MicroTCA is typically in a horizontally mounted chassis. The compact size saves vertical rack space. The backplane features a 20-layer controlled impedance stripline design..
The new eSIP package reduces power supply manufacturing costs. An easy-to-use, low-cost clip reduces heatsink assembly time and improves package to heatsink contact repeatability, ensuring consistently good thermal performance in contrast to the asymmetrically-mounted screw tab on the older TO-220 package design..
International Rectifier Introduces 600V Insulated Gate Bipolar Transistors (IGBTs) in UPS and Solar Inverter Applications
IGBT devices have excessive switching losses at the frequencies used in UPS and solar inverters. The new family of IGBTs has lower collector-to-emitter saturation voltage (VCE(on)) and total switching energy (ETS) than punch-through (PT) and non-punch-through (NPT) type IGBTs..

TI's TPS780xx LDOs with selectable dual-level output voltages allow designers to dynamically shift to a lower voltage level in a battery-powered design when the microprocessor is in sleep mode. The TPS780xx is stable with any output capacitor greater than 0.1uF. The devices come in a 6-pin, 2 mm x 2 mm, SON package, which is targeted at portable applications..
