The Xilinx 3GPP LTE Turbo Encoder and Decoder LogiCORE(TM) offerings deliver throughput speeds of up to 200 Mbps with the embedded digital signal processing (DSP) capabilities of Spartan(R) and Virtex(R) field programmable gate arrays (FPGAs) to meet the voice and ever-increasing data communications requirements imposed on modern wireless systems by the evolving long-term evolution (LTE) standard…

Xilinx Inc. (Nasdaq: XLNX), the world’s leading supplier of programmable logic solutions, announced immediate availability of performance-optimized programmable turbo coding solutions for LTE wireless systems. The new Xilinx 3GPP LTE Turbo Encoder and Decoder LogiCORE(TM) offerings deliver throughput speeds of up to 200 Mbps with the embedded digital signal processing (DSP) capabilities of Spartan(R) and Virtex(R) field programmable gate arrays (FPGAs) to meet the voice and ever-increasing data communications requirements imposed on modern wireless systems by the evolving long-term evolution (LTE) standard.

Javelin’s j360 spec-driven floorplanning capabilities enable users to “plug and play” data from any abstraction level including spreadsheet, black-box, ESL, RTL, gate-level, LEF/DEF, GDSII and foundry technology models. the j360 suite has integrated extremely fast multi-threaded FloorPlacement[tm], Virtual Route[tm] and Organic Placement[tm] engines that deliver realistic predictions of downstream implementation tool flow results in a fraction of the time of traditional commercial solutions…

Javelin Design Automation, provider of System Physical Prototyping[tm] (SPP) EDA solutions for Systems-in-Silicon, unveiled its j360[tm] with TrueFit[tm], TruePlan[tm] and TruePro[tm]: the first-of-its-kind specification-driven virtual silicon prototyping platform tool suite for the enterprise customer. Javelin’s j360 can realistically predict and optimize designs for implementation feasibility and quality-of-results (QoR) in parallel to their design development at the electronic system-level (ESL), register transfer-level (RTL) and netlist stages of design. Its “spec-driven” floorplanning capabilities enable users to “plug and play” data from any abstraction level including spreadsheet, black-box, ESL, RTL, gate-level, LEF/DEF, GDSII and foundry technology models. In this way, users can prototype blocks and chip as they exist in concept and actual design files at any point in the design process.

INA210 Bi-directional Current Shunt Monitors Integrated Circuits can be used in a wide variety of applications, including servers, telecom equipment, automotive, battery management, computers, power supplies and test equipment. The INA210 family provides outstanding accuracy up to 1 percent over the -40C to +125C temperature range, with 35uV maximum offset…

Texas Instruments Incorporated (TI) (NYSE: TXN) introduced a family of high- or low-side measurement, bi-directional current shunt monitor integrated circuits (ICs) in SC70 packages. Utilizing a zero-drift bi-directional architecture, the INA210 family provides outstanding accuracy up to 1 percent over the -40C to +125C temperature range, with 35uV maximum offset. The near elimination of offset with zero-drift reduces the voltage drop and power dissipation in the accompanying shunt resistor by an order of magnitude, which reduces cost and circuit board real estate. The ICs can be used in a wide variety of applications, including servers, telecom equipment, automotive, battery management, computers, power supplies and test equipment.