VIA EPIA P700 Pico-ITX board, couples more features within a streamlined, ultra compact footprint designed for low profile systems, with extended I/O port options through two companion boards. VIA EPIA P700 is based on the VIA VX700 unified digital media IGP chipset and is powered by a 1GHz VIA C7 or fanless 500MHz VIA Eden ULV processor…
VIA EPIA-P700 Pico-ITX Board
An ultra compact Pico-ITX board with Gigabit LAN, S-ATA and an integrated power adapter
VIA Technologies, Inc, a leading innovator of power efficient x86 processor platforms, announced the VIA EPIA P700 Pico-ITX board that couples more features within a streamlined, ultra compact footprint designed for low profile systems, with extended I/O port options through two companion boards. Now featuring native S-ATA II support, Gigabit LAN, and support for GPIO, SM bus and LPC devices, the 10cm x 7.2cm VIA EPIA P700 is based on the VIA VX700 unified digital media IGP chipset and is powered by a 1GHz VIA C7 or fanless 500MHz VIA Eden ULV processor. An integrated power adapter coupled with the 5-volt S-SATA power cable negates the need for a separate power daughterboard, saving considerable space for ultra compact systems.
Z-Stack 2.1.0 software provides full support for both ZigBee and ZigBee PRO feature sets, as well as the latest smart energy profile for advanced metering infrastructure (AMI). Z-Stack 2.1.0 software works in combination with TI’s SmartRF[TM]05 platform, which includes the MSP430 ultra-low power microcontroller (MCU), the CC2520 RF transceiver and the CC2591 range extender, which allows communications over several kilometers…
TI releases free ZigBee® 2007 and ZigBee 2007 PRO software stacks
Z-Stack(TM) 2.1.0 software supports TI’s CC2520 transceiver, MSP430 MCU
Building upon its leading portfolio of hardware and software solutions for ZigBee, Texas Instruments Incorporated (TI) (NYSE: TXN) announced the release of the latest version of its industry-leading ZigBee-certified Z-Stack software for free download. Z-Stack 2.1.0 software provides full support for both ZigBee and ZigBee PRO feature sets, as well as the latest smart energy profile for advanced metering infrastructure (AMI).
2nd annual RoboDevelopment Conference and Exposition is the international technical design and development event for personal, service and mobile robotics industry. The RoboDevelopment Conference and Exposition provides this young industry with the ideal forum for robotics technical professionals to learn from industry leaders, exchange information with their peers and evaluate the latest tools and techniques for building robotics products and technologies…
Robotics Trends Announces 2nd Annual RoboDevelopment Conference & Exposition
International Technical Design and Development Event for Commercial, Mobile Robots Returns to Silicon Valley
Robotics Trends, a division of EH Publishing, Inc., announced their 2nd annual RoboDevelopment Conference and Exposition, the international technical design and development event for personal, service and mobile robotics industry. RoboDevelopment Conference and Exposition will be held November 18-19, 2008 at the Santa Clara Convention Center in Santa Clara, California.