Archive: July 2008 page# 1

Entries summary:

Altera Announces DSP Builder Tool 8.0 Second-Generation Model-Based Synthesis Technology

By pur, at Tuesday, July 1st, 2008, in Programmable Logic, Signal Processing

DSP Builder Tool 8.0 technology allows DSP designers for the first time to automatically generate timing-optimized RTL code based on high-level Simulink design descriptions. DSP Builder's second-generation model-based synthesis technology allows customers to use Simulink as the modeling, simulation and implementation environment of choice for high-performance DSP designs..

 

Ramtron Announces Energy Optimizers Selected Ramtron FM25L512 F-RAM for Plogg

By pur, at Tuesday, July 1st, 2008, in Memory, Semiconductor

The FM25L512 is a 512Kb F-RAM device with an industry-standard serial peripheral interface (SPI). The device reads and writes continuously at bus speeds up to 20MHz and offers low operating currents. FM25L512 F-RAM designed into the Plogg for optimal data logging. In the Plogg, F-RAM provides fast and reliable data storage for up to 5,000 measured values and their associated date/time stamp, at intervals of one minute to one month. designed F-RAM into the Plogg for optimal data logging..

 

Ramtron Announces Energy Optimizers Selected Ramtron FM25L512 F-RAM for Plogg

By pur, at Tuesday, July 1st, 2008, in Memory, Semiconductor

The FM25L512 is a 512Kb F-RAM device with an industry-standard serial peripheral interface (SPI). The device reads and writes continuously at bus speeds up to 20MHz and offers low operating currents. FM25L512 F-RAM designed into the Plogg for optimal data logging. In the Plogg, F-RAM provides fast and reliable data storage for up to 5,000 measured values and their associated date/time stamp, at intervals of one minute to one month. designed F-RAM into the Plogg for optimal data logging..

 

IDT Unveils Ultra Low Power Timing Devices Designed for Use in Ultra Mobile PC

By pur, at Tuesday, July 1st, 2008, in Automation, Power, Semiconductor
idt-umpc

The Ultra Mobile PC (UMPC) Timing Devices feature a 6mm by 6mm micro lead frame (MLF) package, making it 56 percent smaller than standard 8mm by 8mm packages, offering IDT customers a significantly reduced footprint on the board, thus reducing the overall size of the UMPC. These devices are designed for use in applications, such as automotive infotainment, embedded and automation systems, that require an industrial operating temperature range (-40°C to +85°C)..

 

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