The C8051F50x family of mixed-signal MCUs is the first to integrate an ultra high-performance internal precision oscillator to support both CAN and LIN communication networks without an external crystal or resonator. The C8051F50x family provides the highest functional density for automotive applications by integrating a 50 MIPS core, up to 64 kB of high-endurance Flash, four kB of RAM, 32-message buffer CAN 2.0B hardware controller and a hardware LIN 2.0 controller in a 5 x 5 mm2 package, providing customers with the memory and computational resources for real-time applications requiring CAN and LIN software stacks…

Silicon Labs Announces Smallest Automotive Communications Controller

Highly-Integrated C8051F50x Reduces Board Space in Body Electronics

The Pentek’s 7141-420 and 7141-430, transform the 7141 into two distinct and highly integrated products addressing a diverse range of applications. The new 7141-420 and 7141-430 are available in conduction-cooled versions to handle rugged applications in aircraft, UAVs, torpedoes and other severe environments of temperature, shock, vibration, and altitude. The 7141-420 is best suited for general-purpose transceiver functions - such as military radio and signal intelligence transceivers, where engineers need to transmit and receive in a very flexible arrangement of different bandwidths and frequencies for a limited number of channels. The 7141-430 core provides a huge number of relatively narrowband channels. This is of immense value to customers who need a high-density receiver in an unusually small space. The 7141-430 is far more physically dense than any competitive product currently on the market…

3D integration with TSVs could accelerate the consolidation of more to be done in the current fabs CMOS wafer and the transition to a fabless foundry model. As the entire industry chain, all players are at the moment positioning technology and evaluation of 3-D technologies and platforms should be invested for their own businesses. Recent market forecasts indicate that 3D-TSV wafers in the millions and could have a potential impact on the maximum 25% of the memory business in 2015. If we exclude memories, our analysis shows that 3D-TSV wafers accounted for more than 6% of the total semiconductor industry until 2015…

3D TSV Interconnects: Equipments and Materials 2008 Report

The Next Revolution for Semiconductor Packaging & Circuit Assembly Industries