NXP Semiconductors announced the world’s smallest logic plastic packages measuring 0.9 x 1.0 x 0.35 mm with 0.3 mm pitch. The ultra-compact packaging design is ideal for leading-edge portable handheld devices such as smartphones, tablets and SD cards where chip and board space comes at a premium. The SOT1115 package decreases package size by 10 percent for the 6-pin version compared to the previous smallest package, SOT891, of which NXP has produced over one billion units. The 8-pin SOT1116 decreases the package size by 60 percent, compared to the previous smallest 8-pin package SOT833, enabling manufacturers to radically minimize their PCB size.
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Micrel introduced the MIC2860, the latest in its product family of high efficiency White LED (WLED) drivers that greatly extends battery life in today's portable and consumer products. The device is designed to drive two WLEDs and features a typical dropout of 50mV at 30mA per channel. The IC is aimed at portable display backlighting, keypad backlighting and camera flash in mobile devices. The MIC2860 is available in volume quantities with pricing starting at $0.30 for 1K quantities.
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Vishay Intertechnology launched IHLP-3232DZ-11 , a new IHLP; low-profile, high-current inductor that is the industry's first such device in the 3232 case size. Featuring an 8.3 mm by 8.8 mm footprint and ultra-low 4.0 mm profile, the IHLP-3232DZ-11 offers high efficiency with maximum DCR down to 1.35 milliohms and a wide range of standard inductance values from 0.22 through 47.0 microhenries.
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Diodes introduced the first MOSFETs in a new range of space-saving DFN3020 packaged discrete products. Three dual MOSFET combinations have been released, comprising 20V and 30V N-channel and 30V complementary devices. These include the ZXMN2AMC (dual 20V N-channel), ZXMN3AMC (dual 30V N-channel), and ZXMC3AMC (complementary 30V) DFN3020 packaged MOSFETs. While offering a comparable electrical performance as much larger SOT23 packaged parts, these dual DFN3020 MOSFETs will replace two separate SOT23 packaged MOSFETs, resulting in a board space saving of 70%.
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