IBM and Toshiba 32nm CMOS Process Research

In 2008 we’ll continue to strive to collectively deliver the industry
breakthroughs and manufacturing milestones that come from talented engineers and
semiconductor experts working in an open, collaborative environment with access
to world class R&D facilities such as UAlbany NanoCollege’s Albany NanoTech
complex.. - Gary Patton, IBM’s Semiconductor Research and Development Center.

IBM (NYSE: IBM) and Toshiba Corporation announced that they have entered into
a joint development agreement on 32nm bulk complementary metal oxide
semiconductor (CMOS) process technology. Since December 2005, IBM and Toshiba
have collaborated on fundamental advanced research related to semiconductor
process technologies at the 32nm technology generation and beyond at the
research facilities in Yorktown and Albany, New York. Building on the success of
this ongoing research collaboration, the two companies have agreed to extend the
scope of the joint development work to now include 32nm bulk CMOS process
technology.

Under the new agreement, Toshiba joins a six company IBM Alliance for 32nm
bulk CMOS process technology development based in East Fishkill, New York.

Through this collaboration IBM and Toshiba plan to accelerate development of
next-generation technology to achieve high-performance, energy-efficient chips
at the 32nm process level, and to enhance the companies’ leadership in the
global semiconductor industry.

“This agreement caps a year of extraordinary momentum for IBM and its
semiconductor Alliance Partners,” said Gary Patton, vice president for IBM’s
Semiconductor Research and Development Center. “In 2008 we’ll continue to
strive to collectively deliver the industry breakthroughs and manufacturing
milestones that come from talented engineers and semiconductor experts working
in an open, collaborative environment with access to world class R&D
facilities such as UAlbany NanoCollege’s Albany NanoTech complex.”

“This is a promising collaboration,” said Mr. Shozo Saito, Corporate Senior
Vice President of Toshiba Corporation and President & CEO of Toshiba’s
Semiconductor Company. “In addition to continuing the successful collaboration
on fundamental advanced research, Toshiba will jointly develop the
state-of-the-art 32nm bulk CMOS process integration technology, as a member of
the world-class seven-company IBM Alliance. Concurrently we will also
accelerate our own development of integration technology for the 32nm process
at Toshiba’s Advanced Microelectronics Center in Yokohama, toward achieving
early production of leading-edge devices.”

More information: IBM Microelectronics