IBM and Toshiba 32nm CMOS Process Research

By John L Wright, Friday, December 21st, 2007
Category: Research, Semiconductor

In 2008 we’ll continue to strive to collectively deliver the industry
breakthroughs and manufacturing milestones that come from talented engineers and
semiconductor experts working in an open, collaborative environment with access
to world class R&D facilities such as UAlbany NanoCollege’s Albany NanoTech
complex.. - Gary Patton, IBM’s Semiconductor Research and Development Center.

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IBM (NYSE: IBM) and Toshiba Corporation announced that they have entered into
a joint development agreement on 32nm bulk complementary metal oxide
semiconductor (CMOS) process technology. Since December 2005, IBM and Toshiba
have collaborated on fundamental advanced research related to semiconductor
process technologies at the 32nm technology generation and beyond at the
research facilities in Yorktown and Albany, New York. Building on the success of
this ongoing research collaboration, the two companies have agreed to extend the
scope of the joint development work to now include 32nm bulk CMOS process
technology.


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  3. Toshiba and NEC Develop 32-nm LSI Process Technology
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