Elma Announces Ruggedized MicroTCA Enclosures in 19-in Rackmount Format

The new MicroTCA chassis features modified front panels that can be secured to the chassis. This provides more protection for shock and vibration. Shock absorbers/dampers can also be added to the enclosure for extra protection. Thermal management can be achieved via either convection or conduction-cooling. The 19″ rackmount enclosures are designed to meet MIL-STD-810F, 167, 461D, and 901D. Standard ruggedization techniques can be utilized, including a shock isolated card cage and device mounting. Rugged chassis shells are incorporated using thick aluminum sheets, extrusions, and die-castings…

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