Extreme Engineering Solutions (X-ES) Ships OpenVPX Compliant 3U Development Systems: XPand1200 and XPand1300 Development Platform for Conduction-Cooled Modules and Air-Cooled Modules
XPand1200: Conduction-Cooled Development System - Featuring rapid I/O configuration via RTM modules, star PCIe and Gigabit Ethernet topologies, and including PCIe and Gigabit Ethernet switch. The XPand1200 supports up to 550 W of total simultaneous power delivery and a thermal dissipation of up to 50 W per slot. Weighing 38 lbs (including backplane and power supply) and measuring 8.5″ (H) x 11″ (W) x 13″ (L), the XPand1200 is designed to make the path from conduction-cooled development to deployment effortless.
XPand1300: Air-Cooled Development System - Featuring rapid I/O configuration via RTM modules, removable side covers for debug access, star PCIe and Gigabit Ethernet topologies, and including PCIe and Gigabit Ethernet switch. Up to 20 CFM of air-flow is provided per slot as well as 550 W of total simultaneous power delivery. The XPand1300 provides the system developer maximum performance and flexibility; weighing only 19 lbs (including backplane and power supply) and measuring 13.5″ (H) x 13.5″ (W) x 11.6″ (L).
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OpenVPX Compliant 3U Development Systems
(Photos: X-ES)
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