Fresco Logic Unveils World’s First Working PCI Express to SuperSpeed USB xHCI Single Chip Solution with Fully Integrated PCIe and USB 3.0 physical layer device (PHY).

By pur, Friday, May 22nd, 2009
Category: Embedded Computer, IC, Chip, SoC, Memory

Fresco Logic’s demonstration highlights the ability of SuperSpeed USB to deliver significant performance benefits while preserving the familiar USB usage model. This capability provides immediate and easy access to SuperSpeed USB bandwidth for next-generation external hard disk drives, solid-state drives and high-definition video-streaming applications that demand higher bandwidth than USB 2.0 can provide. The availability of USB 3.0 host gives consumers, system OEMs, ODMs, software developers, and USB 3.0 device silicon vendors immediate access to PC and embedded platforms with USB 3.0 connectivity…

USB-3

Fresco-Logic-chip

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SuperSpeed USB Demonstration

Working PCI Express
(Pictures: Frescologic)


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  3. NEC Electronics Introduces µPD720200, the World’s First USB Host Controller for New SuperSpeed USB 3.0 Standard
  4. Northwest Logic Announces High Performance and Hardware Proven x8 PCI Express 2.0 Solution for Virtex-5 FXT FPGA Platform
  5. Agilent Announces Comprehensive Solution for Testing SuperSpeed USB 3.0 Devices
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