Lattice Semiconductor Announces Automotive Temperature Qualified (AEC-Q100) Low-Cost Chip Scale 132 BGA Packaging for the Non-Volatile LatticeXP2 FPGA Family

By pur, Tuesday, June 9th, 2009
Category: Automotive, Vehicle, IC, Chip, SoC, Programmable Logic

Based on Lattice’s 90 nanometer hybrid flexiFLASH™ technology, the XP2 family’s new Chip Scale packaging enables realization of design requirements in the tightest form-factor automotive applications such as automotive camera modules, telematics systems, parking assistance systems and multimedia systems. Low-cost Chip Scale 132 BGA packaging is a compelling solution for automotive designers who value high integration, source synchronous interfaces and low power consumption for tight form-factor applications…

Lattice XP2

LA-LatticeXP2 Automotive Low-Cost Non-Volatile FPGA Family
(Photo: Latticesemi)


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