Micron Announces Dual-Inline Memory Module (LRDIMM), the Industry’s First DDR3 Load-Reduced

By pur, Friday, July 31st, 2009
Category: Memory, Module, SoM, Networking, Semiconductor

The new LRDIMMs provide the option to support higher data frequencies and significantly increase memory capacity. The LRDIMMs will be manufactured using Micron’s leading-edge 1.35-volt, 2-gigabit (Gb) 50-nanometer DDR3 memory chips, allowing the company to easily and cost-effectively increase server module capacity because of the chips’ high-density and industry leading small die size. Micron’s new LRDIMMs reduce the bus load when transferring data between the memory and processor by 50 percent for a dual-rank module and 75 percent for a quad-rank module, when compared to today’s standard DDR3 server modules – registered DIMMs (RDIMMs). Micron’s LRDIMMs enable servers to handle higher frequencies of data to improve overall system performance and support increased number of modules for greater system memory capacity…

lrdimm

LRDIMMs
(Picture: micron)


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