SMART Modular Technologies Announces CoolFlex 32GB DDR3 Very-Low-Profile RDIMM

SMART Modular Technologies announces CoolFlex 32GB DDR3 very-low-profile (VLP; 18.75mm) registered DIMM (RDIMM). With this new product, SMART Modular combines high-density DDR3 DRAM with state-of-the-art flexible substrate technology, dramatically expanding system memory capacity. This new VLP-RDIMM is well suited for use in leading-edge 1U networking and telecom routers and switches.

CoolFlex is a proven technology that helps double memory density, reduce costs, and leverage multi-source DRAM supply chains with highly reliable, high-speed, thermally enhanced DDR3 RDIMMs. By combining CoolFlex and DDR3 technologies, SMART Modular offers OEMs a practical and cost-effective high-density solution that provides a clear alternative to costly quad-die package (QDP) DIMMs.

Configured as quad-rank 4096Mx72, SMART Modular’s CoolFlex 32GB VLP RDIMM allows networking and telecom blade OEM designers to populate their boards with up to four 32GB DIMMs per processor while using vertical sockets. Using off-the-shelf 4Gb DRAMs, SMART Modular’s 16GB VLP CoolFlex RDIMM is configured as a dual-rank solution. Both the 32GB and 16GB CoolFlex modules are targeted at Intel-based networking, telecom and server systems.

32GB VLP DDR3 RDIMM
(Photo from SMART Website)

More information about DDR3 DRAM can be found at SMART Modular Technologies Website