STMicroelectronics Announces SPEAr1310, New Microprocessor for Multiple Embedded Applications
The SPEAr1310 is the industry’s first embedded microprocessor that couples two ARM Cortex-A9 cores with a DDR3 (Third-generation double-data rate) memory interface. The SPEAr1310 is a member of the SPEAr family of embedded MPUs for network devices. It offers an unprecedented combination of processing performance and aggressive power reduction control for next-generation communication appliances. The SPEAr1310 is based on ARM’s new multi-core technology (Cortex-A9 SMP/AMP) and it is manufactured with ST’s 55nm HCMOS low power silicon process. SPEAr1310 targets cost and power sensitive networking applications for the home and small business as well as telecom infrastructure equipment, with lowest overall leakage under real operating conditions. The device integrates ARM’s latest generation (ARMv7) CPU cores, ST’s proven C3 security coprocessor, and advanced connectivity interfaces and controllers.
SPEAr1310 System Connectivity
(Photo from STMicroelectronics Website)
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More information about Microprocessor for Multiple Embedded Applications can be found at STMicroelectronics Website
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