Entries summary:

• Communication Appliance, Unified Communication Appliance
• Firewire, S3200 Specification
• Bsw 201, Gige Switch Blade
• Multilayer Ceramic, Samsung Electro Mechanics

Lanner Electronics Inc, a global leader in network hardware platforms, releases FW-8650, a Unified Communication Appliance designed for a broad array of network service applications; network security, QoS, bandwidth management, load balancing and VoIP. "Lanner has added to its diverse portfolio of network technologies offering a universal platform to build multi-service network appliances," stated Will Chen, CTO. "Based on the Intel Q965 Express Chipset and Intel Core 2 Duo processor combo, and featuring two expansion slots, Lanner has delivered a system that is not only incredibly powerful, it also scales to meet the needs of your specific application." "The Intel Q965 Express chipset offers features that specifically address key requirements in network service applications, such as; increased memory bandwidth, faster system bus and low power processor support," said Rose Schooler, director of marketing, Embedded and Communication Processor Division, Intel...

The S3200 standard will sustain the position of IEEE 1394 as the absolute performance leader in multi-purpose I/O ports for consumer applications in computer and CE devices..

The Ensemble Carrier and Switch Blades have been cornerstone products in Mercury's Ensemble ATCA systems. The enhancements incorporated into our second-generation products were driven by specific customer requirements to extend the capabilities of the RapidIO and Ethernet subsystems..

The combination of the powerful and intuitive Microwave Office design platform with Samsung's MLCC model library provides a top quality solution for designers of today's complex communications products who require highly accurate models of the industry's best devices in order to deliver competitive products. - Ron Patston, AWR vice president. AWR, the innovation leader in high-frequency electronic design automation (EDA), announced at the Asia-Pacific Microwave Conference (AMPC) that Samsung Electro-Mechanics Co. Ltd. (SEMCO) has created and released a model library of its state-of-the-art, high-density, miniaturized, surface-mount multilayer ceramic chip capacitors (MLCCs) for use within AWR's Microwave Office design suite. MLCCs are the most prevalent type of capacitor being utilized at present and their miniature size is well-suited for use in today's increasingly small electronic devices such as cell phones and notebook computers...