a mixed-signal Actel Fusion-based wireless auto-monitoring temperature control design from Xi’an Institute of Posts and Telecommunications won the top prize in the first ever Actel Cup design contest in China. The winning design was chosen by a judging committee from among the 390 submitted designs ranging from automotive and medical to power management solution designs. Demonstrations of the winning designs were available at an awards ceremony in Guangzhou in June…
Actel Announces Winners of First ‘Actel Cup’ Electronics Design Contest in China
Designs Demonstrate Advantages of Actel’s Mixed-signal FPGAs and Set Stage for Future Fusion-based Innovation in China
Actel Corporation (Nasdaq: ACTL) announced that a mixed-signal Actel Fusion-based wireless auto-monitoring temperature control design from Xi’an Institute of Posts and Telecommunications won the top prize in the first ever Actel Cup design contest in China. The winning design was chosen by a judging committee from among the 390 submitted designs ranging from automotive and medical to power management solution designs. Demonstrations of the winning designs were available at an awards ceremony in Guangzhou in June.
15th GSA annual meeting of suppliers Expo and Conference will be presentations and discussions on industry leaders, as well as industry exhibition spotlighting the most innovative products and services. The theme for this year’s conference “Global: Markets, prespectives, Technology,” and will highlight the globalization of all parts of a whole chain of semiconductor design and semiconductor companies, suppliers and ultimately for consumers. The event will be held more than 100 companies, along with nearly 2000 participants from fabless, IDM, OEM-suppliers and service companies…
GLOBAL SEMICONDUCTOR ALLIANCE ANNOUNCES FIFTEENTH ANNUAL SUPPLIERS EXPO & CONFERENCE
One-day Event to Focus on Global Markets, Perspectives and Technology
The Global Semiconductor Alliance (GSA) announces the 15th annual GSA Suppliers Expo & Conference, which will be held on October 2, 2008, at the Santa Clara Convention Center in Santa Clara, Calif. The conference will feature speeches and panel discussions presented by industry leaders, as well as an exhibition spotlighting the industry’s most innovative products and services.
The White Paper Challenge provides a perfect forum for university students to showcase their research investigating new ideas that can be applied in a real-world setting. Rules and submission information for the 2009 White Paper Challenge Program are available online. If a university is not a member, students interested in submitting their papers are encouraged to speak with their university administration or faculty about joining the EAUP…
Ethernet Alliance® Announces 2009 White Paper Challenge for University Students
White paper competition provides an opportunity for student members of Ethernet Alliance University Program (EAUP) to present academic research to industry professionals
The Ethernet Alliance announced the EAUP’s 2009 White Paper Challenge. The program is open to both undergraduate and graduate students of universities that are members of the EAUP. The winning university and student representative will each be awarded a cash prize of $3,000 and the opportunity to present their white paper at next year’s Interop Las Vegas, May 17-22, 2009. White papers must be focused on Ethernet technologies and advancement and must be received or postmarked by February 27, 2009, to be eligible.