Unique eXtreme Switch Gen III features including the ability to drive high-intensity discharge (HID) xenon, halogen and light-emitting diode (LED) light sources with a single device, are engineered to allow automakers to improve lighting efficiency, extend bulb life and reduce bill of material costs. The Third Generation switch also designed to provide greater power management flexibility than other, more conventional products on the market today. The eXtreme Switch Gen III models are N-channel MOSFET switches with extremely low on-resistance, ranging from 10 milliohms to 35 milliohms per channel that can simultaneously control the high sides of up to four light sources…
Freescale’s third-generation eXtreme Switch sets performance standards for automotive lighting
Single IC design provides comprehensive, cost-effective power management solution for halogen, xenon and LED light sources
Taiyo Nippon Sanso and IMEC will develop high-efficiency green LED device manufacturing technology based on IMEC’s compound semiconductors device technology. Research is mainly carried out at the IMEC facilities in Leuven, Belgium and builds on IMEC’s expertise in strain engineering on large wafer diameter, supported by in-situ growth monitoring. IMEC and Taiyo Nippon Sanso Collaboration is a total solution provider in the compound semiconductor field including metal organic materials, gas supply system, purification, abatement system and MOCVD tool, enables to accelerate the development of high efficiency green LED manufacturing technology…
IMEC and Taiyo Nippon Sanso Corp. collaborate on green LED manufacturing technology
IMEC, Europe’s leading independent nanoelectronics research institute, and Taiyo Nippon Sanso Corp. (TNSC), a total solution provider in the compound semiconductor field, announce that they have signed an agreement to jointly develop manufacturing technology for high efficiency LED (light-emitting diode) devices. The agreement marks the first time Taiyo Nippon Sanso collaborates with an advanced research center based in Europe.
The XMC-FPGA05F incorporates the Xilinx® Virtex®-5 FPGA with four front panel fiber-optic transceivers in air- or conduction-cooled versions. The XMC-FPGA05F enables high-speed serial interconnects in embedded real-time DSP systems and the effectiveness of FPGAs to interface to sensor I/O. The XMC-FPGA05F is ideal for demanding real-time applications such as remote sensor interfaces, data recorders, and embedded real-time distributed computing…
VMETRO combines the power of fiber optics with Xilinx Virtex-5 FPGAs in an XMC module
VMETRO’s XMC-FPGA05F enables high-speed sensor I/O for embedded real-time DSP systems
VMETRO, a leader in embedded computing solutions based on standards such as VXS, VPX, XMC and FMC that utilize multi-gigabit serial interconnects, announced a new generation user programmable FPGA XMC/PMC module with fiber-optic transceivers. The XMC-FPGA05F, a follow-on to the very successful PMC-FPGA03F, incorporates the Xilinx® Virtex®-5 FPGA with four front panel fiber-optic transceivers in air- or conduction-cooled versions. The popularity of high-speed serial interconnects in embedded real-time DSP systems and the effectiveness of FPGAs to interface to sensor I/O makes the XMC-FPGA05F ideal for demanding real-time applications such as remote sensor interfaces, data recorders, and embedded real-time distributed computing.