XPA-II is targeted at medium-density, high-speed 1.5V ASIC applications and FPGA-to-ASIC conversions. XPressArray-II has become an established technology for allowing electronic equipment manufacturers to achieve better cost, performance and power specifications than FPGAs and quicker time to market than cell-based solutions…

ON Semiconductor (Nasdaq:ONNN), a global leader in power management solutions, has announced that XPressArray-II (XPA-II), a leading structured ASIC technology formerly offered by AMI Semiconductor, is now available for military specification operating temperatures (as the M-XPA-II Family). By providing operation across the full military operating temperature range of -55°C - 125°C, XPA-II provides military and aerospace manufacturers with a cost-effective route to creating leading-edge ASICs and FPGA-to-ASIC conversions with minimum time to market. On-shore production and full ITAR compliance is assured through all stages of the development process, from initial design through to back-end packaging and test.

Synopsys’ initiative addresses this demand by deploying advanced multi-core software and optimized information technology (IT) solutions that can deliver breakthrough productivity increases. Verification, Design Platforms and DFM Solutions are The three key components of Synopsys’ multi-core initiative to be delivered during 2008…

Synopsys, Inc. (NASDAQ: SNPS), a world leader in software and IP for semiconductor design and manufacturing, announced its multi-core initiative to deploy advanced parallel, threaded and other optimized compute technologies across its Discovery(tm) Verification and Galaxy(tm) Design platforms, and Design for Manufacturing (DFM) solutions. The initiative aims to enable integrated circuit (IC) design companies to easily maximize the throughput of their multi-core compute infrastructure to reduce time-to-results (TTR). This initiative builds on Synopsys’ proven multi-processor and network-distributed electronic design automation (EDA) solutions, including the VCS® functional verification solution with native testbench technology for compute farms and the Proteus lithography solution offering near-linear scalability. Additional multi-core-enabled solutions will be delivered throughout 2008.

The first Pico backplane has been designed for sister-company Elma Electronic’s 1U MicroTCA enclosure solution. The Pico format for MicroTCA is typically in a horizontally mounted chassis. The compact size saves vertical rack space. The backplane features a 20-layer controlled impedance stripline design…

Elma Bustronic Corporation, an industry leading designer and manufacturer of high performance backplanes has announced new MicroTCA backplanes in the Pico style format. The first Pico backplane has been designed for sister-company Elma Electronic’s 1U MicroTCA enclosure solution. The Pico format for MicroTCA is typically in a horizontally mounted chassis. The compact size saves vertical rack space.

The Bustronic Pico backplanes will typically have a Star topology, with one MCH and one Power Module. The rest of the slots will allow for AMC modules in various sizes. The version for the 1U MicroTCA also has connections for a JSM (J-Tag Switch Module) used for diagnostics and the AMC slots are in the single width/mid size.