NL6448BC18-01 and NL6448BC18-01F, consume approximately 50 percent less power compared to displays with cold-cathode fluorescent lamp (CCFL) backlight systems. By using a backlight system - based on highly luminescent white LEDs, an additional inverter circuit is not necessary…

New 5.7-inch LCD modules with backlight system based on white LEDs reduce power consumption by 50 percent

Economical, compact and highly resistant to shock and vibration:

NEC LCD Technologies’ 5.7-inch TFT LCD modules, NL6448BC18-01 and NL6448BC18-01F, consume approximately 50 percent less power compared to displays with cold-cathode fluorescent lamp (CCFL) backlight systems. These TFT LCD modules will - in the future - enhance the product portfolio of Gleichmann Electronics. By using a backlight system - based on highly luminescent white LEDs - an additional inverter circuit is not necessary. As a result, power consumption of the standard model NL6448BC18-01 (brightness 400 cd/m2) is reduced to 1.8 W and in the high-luminance version NL6448BC18-01F(800 cd/m2)to 3.3 W.

The TPS65920, TPS65930 and TPS65950 are three fully integrated power management and signal chain companion chips to support all system power requirements of an OMAP35x processor-based design. The TPS65950 supports up to 14-channels of power management conversion. In addition to integrated 3-MHz DC/DC converters and low-noise LDOs, it includes a dual audio codec and drivers, monitor and control features, a battery charger, an LED driver, a 10-bit, 3-input analog-to-digital converter, vibra and keypad functionality, a high-speed USB transceiver with integrated 5-V power supply and an I2C communications interface — all in a 7 mm x 7 mm BGA package. The TPS65920 and TPS65930 devices, which offer a subset of features of the TPS65950, come in a 10 mm x 10 mm package and support up to 8 voltage rails…

TI expands power management portfolio for OMAP35x processor-based designs

Integrated analog companion chips combine power management and signal chain functionality to optimize power performance

Encounter Power System provides a unified interface and database for timing, signal integrity, power analysis and diagnostics, enabling correct-by-construction optimization and signoff across these domains. The system was tested on multiple designs and process nodes by leading IC companies including Fujitsu Microelectronics, Ltd., Cortina Systems, SiCortex and Tilera, and those companies reported significantly improved productivity, precision, and performance. Encounter Power System delivers these benefits by providing a comprehensive view of timing and power integrity in the design phase. The unified database delivers fast, full-chip power grid analysis, as well as enhanced static and dynamic analysis, electromigration, thermal analysis, and statistical analyses, including on-chip power impacts from package and board parasitics…

Cadence Encounter Power System Delivers Next-Generation Power Integrity and Signoff Analysis for Advanced Node Design

Encounter Power System, Enabled by CPF, Extends Cadence Low-Power Leadership with Full-Featured Power Integrity, Timing, and Signal Integrity Verification