Entries summary:

• Color 3f3f3f, Svstudio Evaluation Kit
• Toshiba, Nec Electronics
• Applied, Fullvision System
• 65 Nanometer, Umc 65nm Fdks

DAFCA Incorporated, an EDA company focused on semiconductor device validation, announced that ClearBlue SVStudio Evaluation Kit is available now, a slimmed down version of its popular post-silicon evaluation tool. About DAFCA DAFCA is the leading vendor of on-chip reconfigurable instruments and analysis tools for on-chip, at-speed silicon validation. Our ClearBlue(TM) platform provides on-chip, at-speed, in-system observability and control with a compact set of user-defined reconfigurable instruments, seamlessly inserted at RTL. DAFCA users extend, for the first time, verification methods into silicon...

Toshiba Corporation, a leader in electronic, communication, digital and power system, together with NEC Electronics Corporation, a global manufacturer of semiconductor products,  today announced that the companies have agreed to collaborate on the development of system LSI process technology for the 32-nanometer (nm) generation. About Toshiba Corporation Toshiba Corporation is a leader in the development and manufacture of electronic devices and components, information and communication systems, digital consumer products and power systems. The company's ability to integrate wide-ranging capabilities, from hardware to software and services, assure it position as a innovator in diverse fields and many businesses. In semiconductors, Toshiba continues to promote its leadership in the fast growing system LSI market and to build on its world-class position in NAND flash memories, analog devices and discrete devices...

  Dr. Hichem M'Saad, vice president and general manager of Applied Materials' Dielectric Systems and CMP Business Group was said CMP endpoint technology was pioneered by Applied Materials and is key to delivering benchmark CMP performance,"  CMP as films become thinner, CMP becomes increasingly difficult, requiring much more precise wafer-to-wafer process control to achieve acceptable yields. Using broadband spectral analysis, FullVision technology monitors individual polishing zones across the wafer to provide twice the accuracy and repeatability of competitive systems on a wide variety of process steps – without compromising throughput. These are vital requirements for advanced device manufacturing." Applied Materials, introduses its new Applied FullVision(TM) system that enables real-time control of dielectric CMP1 processes to the 45 nanometer (nm) device node and beyond. The FullVision system couples Applied's patented window-in-pad technology with multiple-wavelength spectroscopy to deliver advanced in situ endpoint capability for a variety of dielectric materials, including oxide, STI2, and poly CMP applications...

Cadence Design Systems, Inc.and UMC announced the availability of UMC 65-nanometer Foundry Design Kits (FDKs) for the latest Cadence Virtuoso custom design platform (IC 6.1) release. The kits will be available for designers using UMC's logic/mixed-mode 65-nanometer standard performance (SP) process and logic/mixed- mode RF 65-nanometer low-leakage (LL) process. The Cadence Virtuoso technology helps accelerate silicon-accurate design of analog, mixed-signal and RF devices. "The availability of the 65-nanometer design kits will help our customers more quickly realize the performance and power consumption advantages of our production proven 65-nanometer SP and RF LL technology," said Patrick T...