Entries summary:

• Toshiba, 32nm Cmos
• E1 Demodulator, E1 Demodulator Plus
• Axi 940, Defect Inspection Module
• Multi Rate, Rate Backplane Transceiver

In 2008 we'll continue to strive to collectively deliver the industry breakthroughs and manufacturing milestones that come from talented engineers and semiconductor experts working in an open, collaborative environment with access to world class R&D facilities such as UAlbany NanoCollege's Albany NanoTech complex.. - Gary Patton, IBM's Semiconductor Research and Development Center. IBM (NYSE: IBM) and Toshiba Corporation announced that they have entered into a joint development agreement on 32nm bulk complementary metal oxide semiconductor (CMOS) process technology. Since December 2005, IBM and Toshiba have collaborated on fundamental advanced research related to semiconductor process technologies at the 32nm technology generation and beyond at the research facilities in Yorktown and Albany, New York. Building on the success of this ongoing research collaboration, the two companies have agreed to extend the scope of the joint development work to now include 32nm bulk CMOS process technology...

SIDSA Intoduced Enter e1 Demodulator plus Application Processor Chipset. This new chipset complements the current offering of Intellectual Property for DVB-H demodulator..

The new AXi 940 module will perform wafer frontside inspection as part of the all-surface Explorer(tm) Inspection Cluster—a multi-surface inspection system designed to deliver fast, accurate and reliable macro inspection at a low cost-of-ownership..

The VSC3406 achieves highly advanced operations between 0.125 Gbps and 6.375 Gbps. The multi-rate CDR of the VSC3406 makes it ideally suited for next-generation backplanes and communication equipment running a variety of protocols..