The LTC5598 is a direct I/Q modulator designed for high performance wireless applications, including wireless infrastructure. It allows direct modulation of an RF signal using differential baseband I and Q signals. It supports point-to-point microwave link, GSM, EDGE, CDMA, 700MHz band LTE, CDMA2000, CATV applications and other systems. It may also be configured as an image reject upconverting mixer, by applying 90° phase-shifted signals to the I and Q inputs. The LTC5598 has outstanding dynamic range performance, from low frequency to above 1GHz, making it ideal for point-to-point broadband microwave links, 450MHz and 700MHz LTE basestation transmitters, 800MHz GSM / 900MHz EDGE basestation transmitters, 880MHz CDMA2000 basestations, video and cable broadband modulators, multiband military radios, 900MHz multiprotocol RFID readers and satellite transmitters...
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The agreement between the two companies includes the licensing by Soitec to ST of the Smart Stacking bonding technology for the manufacturing of backside-illumination sensors on 300mm wafers. This technology, developed by Soitec’s Tracit business unit, leverages molecular bonding, and mechanical, as well as chemical thinning. ST will develop a new generation of image sensors based on its advanced derivative-CMOS process technology at 65nm and beyond, at its 300mm facility in Crolles, France. The Smart Stacking technology will enable ST to increase its leadership in developing and supplying high-performance image sensors for mobile consumer products. Backside illumination technology (BSI) is a key ingredient in the small-pixel, high-image-quality race for the development of leading-edge image sensors...
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The XLP Processor family integrates a superscalar processor core that operates at over 2.0GHz and offers a 3x performance-per-watt improvement over previous generation cores to deliver higher levels of system performance and scalability for networking, communications, data center, 3G/4G mobile wireless, security and storage applications. NetLogic Microsystems and RMI will cooperate to develop reference designs that include the new XLP Processors along with industry-leading knowledge-based processors, NETL7 Layer 7 knowledge-based processors and 10-Gigabit Ethernet PHY products from NetLogic Microsystems. The collaboration will help customers accelerate time-to-market and reduce development costs for advanced, next-generation systems, such as switches, routers, 3G/4G mobile infrastructure equipment, security appliances, storage appliances and gateways...
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RFaxis' single-chip, single-die, RFX2401 and RFX2402 are poised to replace conventional larger, multi-die front-end modules. Leveraging BiCMOS technology, RFaxis' chips are designed to reduce the complexity of wireless designs, lower manufacturing costs via a smaller footprint and reduced bill of materials cost, accelerate time to market, provide superior performance for a competitive advantage, and are ultra low power to offer improved power efficiency over conventional front-end module technologies. The RFX2401 is the first and only fully integrated, single-chip, single-die Bluetooth/Zigbee RFeIC (RF Front-end Integrated Circuit) on the market. Designed for use in Bluetooth Class-1 and Single-Port Zigbee applications, the RFX2401 combines superior performance, high sensitivity and efficiency, low noise, small form factor, and low cost to form an ideal solution for applications requiring extended range and bandwidth with a potential 10x range increase. the RFX 2402 WLAN RFeIC is designed for use in 802.11x and Dual-Port Zigbee applications operating at 2.4GHz. Ideal for single antenna applications and/or the building block for MIMO applications, the RFX2402 also requires the same minimal external components as the RFX2401...
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