Embedded System News .Com - Wireless - Page# 82

TI

Texas Instruments Incorporated introduced bq51013 receiver IC, next generation of wireless power technology, which is 80-percent smaller than TI's previous receiver chip. The tiny, highly integrated device makes it easy for designers to implement wireless charging in their existing and new designs for portable consumer devices, such as smart phones, gaming systems, digital cameras, and medical and industrial equipment.
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M2M PICtail Daughter Board

Microchip Technology announced a Machine-to-Machine (M2M) PICtail Daughter Board (part # AC320011) that comes with all of the hardware, wireless-communication protocols and application-code examples needed to help designers jump start their fleet-management or location-based service application. Developed with u-blox, the new Daughter Board includes the u-blox NEO-6Q GPS and LEON GSM/GPRS modules, and interfaces with Microchip’s Multimedia Expansion Board (part # DM320005), and PIC32 Starter Kit (part # DM320001). The board enables the quick and easy creation of designs offering communications, as well as a complete graphics interface, with audio, accelerometer and networking capabilities.
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freescale-logo

Freescale Semiconductor introduced MRF8P20165WH/S and MRF8P20140WH/S, two LDMOS RF power transistors that allow wireless base station amplifiers to cover all channels in an entire allocated frequency band. The high-efficiency transistors help reduce capital and operating expenditures, and their wide instantaneous bandwidth allows operators to increase network flexibility.
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cypress logo

Cypress Semiconductor and Redpine Signals have jointly developed 802.11a/b/g/n wireless-connectivity solutions that make it easy for system engineers to add low-power, single-stream 802.11n Wi-Fi capability to embedded systems with Cypress's PSoC; 3 and PSoC 5 programmable system-on-chip platforms. These solutions are based on the Connect-io-n modules from Redpine Signals; that make it easy to design new systems and upgrade existing products to provide reliable wireless data communications that meet stringent power and high throughput requirements.
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